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Vol. 1 No. 1 (2025): July : MicroOhm Journal of Electrical and Computer Engineering
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MicroOhm Journal of Electrical and Computer Engineering with E-ISSN: XXXX-XXXX published by CV. Multimedia Teknologi Kreatif. It supports peer-reviewed research in electrical, computer, and information systems. Each paper has been peer-reviewed to ensure the highest academic standards and relevance to current technological advancements. This journal is published twice a year (July and December).

Published: 2025-07-31
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MicroOhm Journal of Electrical and Computer Engineering

MicroOhm Cover

Journal of Electrical and Computer Engineering [E-ISSN: XXXX-XXXX] is a scientific journal published periodically twice a year and aims as a forum for scientific publications for researchers, academics, practitioners, and students in the fields of electrical engineering, computer engineering, and information systems.

This journal presents articles on research results, literature reviews, and other scientific writings that have high relevance to the development of science and technology in these fields.

All articles published in MicroOhm go through a rigorous peer-reviewed process to ensure originality, scientific quality, and contribution to the field.

This journal is open access, allowing all people to access and utilize research results without barriers.

MicroOhm is published by CV. Multimedia Teknologi Kreatif and is open for publication in English. Through this platform, MicroOhm is committed to supporting the dissemination of knowledge and strengthening academic networks at the national and international levels.

 

Indexing:

MicroOhm is indexed by several scientific databases to ensure maximum discoverability and global access to research content.

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Current Issue

Current Issue Cover

Vol. 1 No. 1 (July 2025)

Published: July, 2025

Scope of This Issue

This edition highlights selected topics within the journal's focus, including:

  • Electrical Power and Smart Grids
  • Embedded Systems and Internet of Things (IoT)
  • Signal Processing & Wireless Communications
  • Artificial Intelligence and Machine Learning
  • Computer Engineering and Information Systems

Dive into this issue to explore innovations and research breakthroughs that shape the future of engineering and technology.

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